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Patent Searching and Data


Title:
FIXING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/077913
Kind Code:
A1
Abstract:
Provided is a fixing structure in which a gap is maintained between a through-hole wall surface and a protrusion. In order to fix a metal plate 10 to a resin plate 20 by heat staking, a through-hole 11 having a larger diameter than that of a heat staking protrusion 21 formed on the resin plate 20 is formed in the metal plate 10. Then, a sheet material 30 having a low thermal conductivity is laid on the metal plate 10. The sheet material 30 has a small-diameter through-hole 31 just large enough to allow the heat staking protrusion 21 to pass through. Then, with the sheet material 30 laid on the metal plate 10, the heat staking protrusion 21 is heated and melted to fix the metal plate 10 to the resin plate 20 by heat staking.

Inventors:
AJISAKA TOSHIHARU (JP)
Application Number:
PCT/JP2016/081684
Publication Date:
May 11, 2017
Filing Date:
October 26, 2016
Export Citation:
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Assignee:
TYCO ELECTRONICS JAPAN G K (JP)
International Classes:
B29C65/56; B32B7/08
Foreign References:
JP2011254001A2011-12-15
JP2003011232A2003-01-15
JPH09109268A1997-04-28
JPH0463227U1992-05-29
Other References:
See also references of EP 3372387A4
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