FLAKE-LIKE SILVER POWDER, CONDUCTIVE PASTE, AND METHOD FOR PRODUCING FLAKE-LIKE SILVER POWDER

Title:

FLAKE-LIKE SILVER POWDER, CONDUCTIVE PASTE, AND METHOD FOR PRODUCING FLAKE-LIKE SILVER POWDER

Document Type and Number:

WIPO Patent Application WO/2014/208250

Kind Code:

A1

Abstract:

Provided are: a flake-like silver powder which is obtained using a specific wet reduction method and has a low bulk density, a specific average particle diameter (D50) and the like; a conductive paste which uses this flake-like silver powder; and a method for producing this flake-like silver powder. A flake-like silver powder which is obtained by a wet reduction method, a conductive paste which uses this flake-like silver powder, and a method for producing this flake-like silver powder. The average particle diameter (D50) as a circle-equivalent diameter when the flake-like silver powder is viewed in plan is set to a value within the range of 1.1-30 μm; the thickness of the flake-like silver powder is set to 0.01-2 μm; and the bulk density of the flake-like silver powder is set to a value within the range of 0.1-4 g/cm3.

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Inventors:

HORI SHIGEO (JP)
FURUI HIROHIKO (JP)

Application Number:

PCT/JP2014/063938

Publication Date:

December 31, 2014

Filing Date:

May 27, 2014

Export Citation:

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Assignee:

KAKEN TECH CO LTD (JP)

International Classes:

B22F1/052; B22F1/068; B22F1/10; B22F9/24; H01B1/00; H01B1/22; H01B13/00

Domestic Patent References:

WO2012147945A1

2012-11-01

Foreign References:

JP2013036116A	2013-02-21
JP2007107057A	2007-04-26
JP2009013449A	2009-01-22
JP2012036481A	2012-02-23

Other References: