Title:
FLAKE-SHAPED MICROPARTICLES
Document Type and Number:
WIPO Patent Application WO/2014/155834
Kind Code:
A1
Abstract:
Provided are flake-shaped microparticles (2) having an electroconductive metal as a principal component. A typical metal is gold, and the metal has a monocrystalline structure. The arithmetic surface roughness (Ra) of the surface of the microparticles (2) is no greater than 10 nm. The microparticles (2) and substances such as a solvent, a binder, and a dispersant are mixed and an electroconductive paste is obtained. Provided are microparticles (2) in which printing a pattern for connecting elements, using the electroconductive paste, on a printed substrate of an electronic device results in excellent printing properties, heat conductivity, and electric conductivity.
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Inventors:
LEE WOOJIN
WAKASAKI SHUN
KANAMORI TAKAYUKI
WAKASAKI SHUN
KANAMORI TAKAYUKI
Application Number:
PCT/JP2013/082461
Publication Date:
October 02, 2014
Filing Date:
December 03, 2013
Export Citation:
Assignee:
TOKUSEN KOGYO KK (JP)
International Classes:
B22F1/068; B22F1/107; B22F9/30; H01B1/00; H01B1/22; H01B5/00
Domestic Patent References:
| WO1999054074A1 | 1999-10-28 | |||
| WO2011024407A1 | 2011-03-03 |
Foreign References:
| JP2003147270A | 2003-05-21 | |||
| JP2008202076A | 2008-09-04 | |||
| JP2006063414A | 2006-03-09 |
Other References:
See also references of EP 2942128A4
Attorney, Agent or Firm:
OKA Kengo et al. (JP)
岡 Kengo (JP)
岡 Kengo (JP)
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