FLAME-RESISTANT, MOISTURE-CURABLE RESIN COMPOSITION

WIPO Patent Application WO/2011/132629

A1

The disclosed flame-resistant, moisture-curable resin composition does not use halogen-based flame resistant agents, antimony oxide or similar, and is V-0 under UL94 vertical combustion testing. Furthermore, despite having a high flame resistance, the composition has a low viscosity and therefore has good workability, and exhibits excellent adhesive properties. Additionally, the composition has low volatility and low bleed-out properties, and has a cured product which is also strong. The disclosed flame-resistant, moisture-curable resin composition contains as essential components: an organic polymer (A) which contains at least two crosslinkable hydrolyzable silyl groups; a metal hydroxide (B) having an average particle diameter of 0.1-200μm; and a polyether compound (C) which has a crosslinkable hydrolyzable silyl group only at one end. The mix ratio of component (A) and component (C) is 80:20-50:50 in terms of mass ratio.

WO/2009/020040	CURABLE COMPOSITION
JPH0841350	SEALANT COMPOSITION
JPH09296123	NEW CURABLE COMPOSITION CONTAINING NON-AQUEOUS LIQUID DISPERSION

IDE MIYOKA (JP)
MAEDA YASUO (JP)
FUJISAWA TSUNETOSHI (JP)
MATSUKI TAKASHI (JP)
MOTOKI SHIGEKAZU (JP)

PCT/JP2011/059494

October 27, 2011

April 18, 2011

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THREE BOND CO LTD (JP)
IDE MIYOKA (JP)
MAEDA YASUO (JP)
FUJISAWA TSUNETOSHI (JP)
MATSUKI TAKASHI (JP)
MOTOKI SHIGEKAZU (JP)

C08L101/10; C08K3/22; C08L71/02

JP2007332258A	2007-12-27
JP2003342465A	2003-12-03
JP2007084633A	2007-04-05

HATA MASANORI (JP)
秦 Masanori (JP)

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