Title:
FLAME-RETARDANT POLYAMIDE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/205938
Kind Code:
A1
Abstract:
Provided is a flame-retardant polyamide resin composition suitable for electrical/electronic parts and housing parts that reduces mold corrosion while having high heat resistance and high flame retardancy suited to a reflow soldering process and also has excellent mechanical properties, bleed-out resistance, low water absorption, and fluidity. A flame-retardant polyamide resin composition characterized by containing a semi-aromatic polyamide resin (A), a halogen group-containing flame retardant (B), at least one metal salt flame retardancy promoter (C) selected from the group consisting of zinc stannate, zinc borate, zinc phosphate, calcium borate, and calcium molybdate, an inorganic reinforcing material (D), and a metal oxide comprising an oxide of bismuth (E) in proportions of 20-70 mass%, 5-15 mass%, 0.5-15 mass%, 20-60 mass%, and 0.5-5 mass%, respectively.
Inventors:
SHIBUYA TAKITO (JP)
YAMADA JUN (JP)
YAMADA JUN (JP)
Application Number:
PCT/JP2021/013483
Publication Date:
October 14, 2021
Filing Date:
March 30, 2021
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08G69/00; C08K3/013; C08K3/22; C08K3/24; C08K7/14; C08L25/18; C08L77/00
Domestic Patent References:
| WO2015056765A1 | 2015-04-23 |
Foreign References:
| JPS4843385B1 | 1973-12-18 | |||
| JP2006265539A | 2006-10-05 | |||
| JP2011074361A | 2011-04-14 |
Attorney, Agent or Firm:
KAZAHAYA, Nobuaki et al. (JP)
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