Title:
FLAME-RETARDANT SOLDER RESIST COMPOSITION AND FLEXIBLE WIRING BOARD WHICH IS OBTAINED USING SAME
Document Type and Number:
WIPO Patent Application WO/2011/062053
Kind Code:
A1
Abstract:
Disclosed is a solder resist composition which is capable of forming a solder resist that has excellent flame retardancy, low elasticity, high elongation and folding resistance in addition to adhesion to a substrate, low warping properties and solder heat resistance.
Specifically disclosed is a flame-retardant solder resist composition which is characterized by containing (A) a carboxyl group-containing photosensitive resin, (B) an acrylated urethane resin, (C) a photopolymerization initiator, (D) a diluent, (E) an epoxy compound and (F) a phosphorus-containing organic filler.
Inventors:
TANIGUCHI HIROAKI (JP)
SAITO TAKAHIDE (JP)
KAKIUCHI NAOYA (JP)
KATAGIRI SHIGEKI (JP)
SAITO TAKAHIDE (JP)
KAKIUCHI NAOYA (JP)
KATAGIRI SHIGEKI (JP)
Application Number:
PCT/JP2010/069461
Publication Date:
May 26, 2011
Filing Date:
November 02, 2010
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK (JP)
TANIGUCHI HIROAKI (JP)
SAITO TAKAHIDE (JP)
KAKIUCHI NAOYA (JP)
KATAGIRI SHIGEKI (JP)
TANIGUCHI HIROAKI (JP)
SAITO TAKAHIDE (JP)
KAKIUCHI NAOYA (JP)
KATAGIRI SHIGEKI (JP)
International Classes:
G03F7/027; C08G59/40; G03F7/004; G03F7/032; G03F7/038; H05K3/28
Domestic Patent References:
| WO2008108357A1 | 2008-09-12 | |||
| WO2009090867A1 | 2009-07-23 |
Foreign References:
| JP2002296776A | 2002-10-09 | |||
| JP2007017644A | 2007-01-25 | |||
| JP2001166469A | 2001-06-22 | |||
| JP2007249148A | 2007-09-27 |
Attorney, Agent or Firm:
EMURA Yoshihiko et al. (JP)
Yoshihiko Emura (JP)
Yoshihiko Emura (JP)
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