FLAT CABLE COVERING MATERIAL, AND FLAT CABLE

Title:

FLAT CABLE COVERING MATERIAL, AND FLAT CABLE

Document Type and Number:

WIPO Patent Application WO/2004/112058

Kind Code:

A1

Abstract:

A flat cable covering material which has a base material film and, provided on one surface thereof, a thermal adhesive layer (P + V) containing at least a filler (P) and a thermoplastic resin (V), wherein the mass proportion (P)/(P + V) is distributed in a graduated manner in the direction of the thickness of the thermal adhesive layer, preferably, is gradiatedly distributed in such a manner that the mass proportion decreases from the base material film side to the side of the surface of the thermal adhesive layer in the range of (P)/(P + V) = 90 to 50 mass %, or wherein the filler (P) component comprises a hydrated metal compound (P₁) and the mass proportion (P₁)/(P) is gradiatedly distributed in such a manner that the mass proportion (P₁)/(P) decreases from the base material film side to the side of the surface of the thermal adhesive layer in the range of (P₁)/(P) = 80 to 0 mass %.

Inventors:

IMAMURA HIDEKI (JP)
HORI YAICHIROU (JP)
YAMAMOTO HIROSHI (JP)

Application Number:

PCT/JP2004/007502

Publication Date:

December 23, 2004

Filing Date:

May 31, 2004

Export Citation:

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Assignee:

DAINIPPON PRINTING CO LTD (JP)
IMAMURA HIDEKI (JP)
HORI YAICHIROU (JP)
YAMAMOTO HIROSHI (JP)

International Classes:

C09J7/02; C09J11/04; C09J11/06; C09J201/00; H01B3/18; H01B7/08; H01B7/295; (IPC1-7): H01B7/08; H01B7/295

Foreign References:

JP2002279831A	2002-09-27
JP2003086029A	2003-03-20
JPH1083721A	1998-03-31
JPH09221642A	1997-08-26
JPH09279101A	1997-10-28
JPH06267338A	1994-09-22
JPH05128918A	1993-05-25

Attorney, Agent or Firm:

Yoshitake, Kenji (Room 323 Fuji Bldg., 2-3, Marunouchi 3-chom, Chiyoda-ku Tokyo 05, JP)

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