FLAT LOOP HEAT PIPE-BASED VAPOR CHAMBER

WIPO Patent Application WO/2018/191836

A1

A flat loop heat pipe-based vapor chamber, comprising an aluminum alloy plate and a flat loop heat pipe pre-embedded therein and consisting of an evaporator (1), a liquid reservoir (3), and a gas/liquid pipe (7). The evaporator (1) of the flat loop heat pipe is distributed in an area on the vapor chamber affixed to the largest heat source of a chip to be cooled. The evaporator (1) is affixed at a side thereof having a vapor channel to the largest heat source. Provided on the vapor chamber are a "heat sink affixing area" and a "heat source affixing area." The gas/liquid pipe (7) leading out from an outlet of the evaporator (1) is arranged back and forth between the "heat sink affixing area" and the "heat source affixing area." The gas/liquid pipe (7) ultimately returns to the liquid reservoir (3) of the flat loop heat pipe after passing through the "heat sink affixing area." The vapor chamber increases heat transfer capacity, extreme heat flux cooling capacity, and overload-prevention and antigravity working capacity, increases the size of a heat dissipating plate and reduces the thickness thereof, and solves the conflicting demand of increased heat dissipating plate performance on capillary core aperture size.

ZHANG HONGXING (CN)
MAN GUANGLONG (CN)
HUANG JINYIN (CN)
LI GUOGUANG (CN)

PCT/CN2017/000655

October 25, 2018

October 31, 2017

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BEIJING INST SPACECRAFT SYSTEM ENGINEERING (CN)
ZHANG HONGXING (CN)
MAN GUANGLONG (CN)
HUANG JINYIN (CN)
LI GUOGUANG (CN)

F28D15/04

WO2011130313A1

2011-10-20

CN107131784A	2017-09-05
CN202630760U	2012-12-26
CN105091643A	2015-11-25
CN103824826A	2014-05-28

See also references of EP 3614089A4

BEIJING INSTITUTE OF TECHNOLOGY PATENT CENTER (CN)

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