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Title:
FLAT LOOP HEAT PIPE-BASED VAPOR CHAMBER
Document Type and Number:
WIPO Patent Application WO/2018/191836
Kind Code:
A1
Abstract:
A flat loop heat pipe-based vapor chamber, comprising an aluminum alloy plate and a flat loop heat pipe pre-embedded therein and consisting of an evaporator (1), a liquid reservoir (3), and a gas/liquid pipe (7). The evaporator (1) of the flat loop heat pipe is distributed in an area on the vapor chamber affixed to the largest heat source of a chip to be cooled. The evaporator (1) is affixed at a side thereof having a vapor channel to the largest heat source. Provided on the vapor chamber are a "heat sink affixing area" and a "heat source affixing area." The gas/liquid pipe (7) leading out from an outlet of the evaporator (1) is arranged back and forth between the "heat sink affixing area" and the "heat source affixing area." The gas/liquid pipe (7) ultimately returns to the liquid reservoir (3) of the flat loop heat pipe after passing through the "heat sink affixing area." The vapor chamber increases heat transfer capacity, extreme heat flux cooling capacity, and overload-prevention and antigravity working capacity, increases the size of a heat dissipating plate and reduces the thickness thereof, and solves the conflicting demand of increased heat dissipating plate performance on capillary core aperture size.

Inventors:
ZHANG HONGXING (CN)
MAN GUANGLONG (CN)
HUANG JINYIN (CN)
LI GUOGUANG (CN)
Application Number:
CN2017/000655
Publication Date:
October 25, 2018
Filing Date:
October 31, 2017
Export Citation:
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Assignee:
BEIJING INST SPACECRAFT SYSTEM ENGINEERING (100094, CN)
ZHANG HONGXING (100094, CN)
MAN GUANGLONG (100094, CN)
HUANG JINYIN (100094, CN)
LI GUOGUANG (100094, CN)
International Classes:
F28D15/04
Domestic Patent References:
WO2011130313A12011-10-20
Foreign References:
CN107131784A2017-09-05
CN202630760U2012-12-26
CN105091643A2015-11-25
CN103824826A2014-05-28
Attorney, Agent or Firm:
BEIJING INSTITUTE OF TECHNOLOGY PATENT CENTER (100081, CN)
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