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Patent Searching and Data


Title:
FLAT-PACK PAPER CONTAINER AND FILM ADHESION MOLDING MACHINE
Document Type and Number:
WIPO Patent Application WO/2021/131164
Kind Code:
A1
Abstract:
[Problem] To provide a flat-pack paper container whereby leakage of contained matter or the seepage of contained matter from a container section of a container main body is suppressed. [Solution] A flat-pack paper container (1) that includes: a container main body (11) having a container section (12); and resin film (3). The container main body (11) has: a floor surface (121); a plurality of side surfaces (122); and a flange section (13) that is connected to the plurality of side surfaces (122) and, after assembly, is flush with a top surface (131). The top surface (131) has gaps (22) extending from the container section (12) towards the outside of the container main body (11). The resin film (3) covers the top surface (131) and has protruding sections (31) above the gaps (22) that traverse the gaps (22).

Inventors:
YAMAGUCHI MASARU (JP)
KAIMORI TOMOKAZU (JP)
NARITA KODAI (JP)
Application Number:
PCT/JP2020/033074
Publication Date:
July 01, 2021
Filing Date:
September 01, 2020
Export Citation:
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Assignee:
TOKAN KOGYO CO LTD (JP)
International Classes:
B65D5/56; B65D5/20
Foreign References:
JPH08119260A1996-05-14
JPH04142246A1992-05-15
JP2002012213A2002-01-15
JPH06293334A1994-10-21
JP2019172339A2019-10-10
Other References:
See also references of EP 4082926A4
Attorney, Agent or Firm:
ABIKO Gen (JP)
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