Title:
FLEXIBLE BASE MATERIAL, PACKAGE MEMBER, AND METHOD FOR USING PILL MANAGEMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/182069
Kind Code:
A1
Abstract:
A flexible base material is provided with: a first substrate, that is a middle substrate (10), on one surface (10b) of which an electrically conductive circuit pattern (15) including a terminal group (17) is formed; and a second substrate, that is a lower substrate (20), which is connected to the first substrate (10) by way of a bend assisting means (41). The first substrate (10) includes an exposed region (11) which is exposed from the second substrate (20) when the first substrate (10) has been folded at the bend assisting means (41) with the second substrate (20) overlaid on the one surface (10b), and the terminal group (17) of the conductive circuit pattern (15) is disposed in the exposed region (11). A protection sheet (45) covers the terminal group (17) when the second substrate (20) has been folded at the bending assist means (41).
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Inventors:
TAKAHASHI HIROKO (JP)
NANJO KAYOKO (JP)
BIZEN TAKEHIKO (JP)
NANJO KAYOKO (JP)
BIZEN TAKEHIKO (JP)
Application Number:
PCT/JP2016/064338
Publication Date:
November 17, 2016
Filing Date:
May 13, 2016
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H05K1/02; A61J1/00; A61J1/03; A61J7/02; H05K1/11
Foreign References:
| JP2011514294A | 2011-05-06 | |||
| US20070246396A1 | 2007-10-25 | |||
| JP2015083108A | 2015-04-30 | |||
| JP2004503271A | 2004-02-05 | |||
| JP2015070938A | 2015-04-16 | |||
| DE102005046725A1 | 2007-04-05 |
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
Hiroyuki Nagai (JP)
Hiroyuki Nagai (JP)
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