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Title:
FLEXIBLE BOARD
Document Type and Number:
WIPO Patent Application WO/2020/240999
Kind Code:
A1
Abstract:
This flexible board is provided with: an insulating substrate having a first surface and a second surface on the reverse side of the first surface; a wiring layer provided on the second surface side of the insulating substrate; and a resin layer having a support body positioned on the first surface side of the insulating substrate and a coating layer positioned on the second surface side of the insulating substrate, wherein the resin layer has a first region and a second region when viewed in a plan view, the resin layer has a first elastic modulus in the first region and a second elastic modulus in the second region, and the first elastic modulus is greater than the second elastic modulus.

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JPH0621270[Name of device] Printed wiring board
Inventors:
SANO TAKUMI (JP)
Application Number:
PCT/JP2020/011780
Publication Date:
December 03, 2020
Filing Date:
March 17, 2020
Export Citation:
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Assignee:
JAPAN DISPLAY INC (JP)
International Classes:
H05K1/02
Domestic Patent References:
WO2007119608A12007-10-25
Foreign References:
JP2017227830A2017-12-28
JP2016018198A2016-02-01
JP2015121777A2015-07-02
US20160218305A12016-07-28
Attorney, Agent or Firm:
S & S INTERNATIONAL PPC (JP)
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