Title:
FLEXIBLE CIRCUIT BOARD ASSEMBLY HAVING FIXING MEANS AND LAMP UNIT USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/103553
Kind Code:
A1
Abstract:
The present invention relates to a flexible circuit board assembly having a fixing means and a lamp unit using the same. More specifically, the present invention relates to a flexible circuit board assembly having a fixing means capable of fixing a flexible circuit board assembly without a stacking process and a lamp unit using the same. Since the flexible circuit board assembly having a fixing means and the lamp unit using the same, according to the present invention, can be fixed to a fastening member by using the form of a heat dissipation layer of the flexible circuit board assembly without a separate stacking process, the manufacturing process thereof is simplified and thus productivity can be improved, and it is possible to prevent damage to LEDs, thereby reducing a defect rate.
Inventors:
HUR JEONG WOOK (KR)
PARK BUM GYUN (KR)
IM KWANG JO (KR)
PARK BUM GYUN (KR)
IM KWANG JO (KR)
Application Number:
PCT/KR2018/014623
Publication Date:
May 31, 2019
Filing Date:
November 26, 2018
Export Citation:
Assignee:
LEDLITEK CO LTD (KR)
International Classes:
H05K7/14
Foreign References:
KR20170084800A | 2017-07-21 | |||
JP2014063975A | 2014-04-10 | |||
JP2009238988A | 2009-10-15 | |||
KR101501163B1 | 2015-03-12 | |||
KR101679673B1 | 2016-11-25 |
Attorney, Agent or Firm:
LEE, Jea Ryang (KR)
Download PDF:
Previous Patent: RESOURCE ELEMENT OFFSETTING IN A TELECOMMUNICATION SYSTEM
Next Patent: WATER TREATMENT APPARATUS
Next Patent: WATER TREATMENT APPARATUS