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Patent Searching and Data


Title:
FLEXIBLE CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2024/043595
Kind Code:
A1
Abstract:
A flexible circuit board according to an embodiment comprises: a base material having a first surface and a second surface opposite the first surface; a circuit pattern disposed on the first surface of the base material; and a protective layer on the circuit pattern. The circuit pattern includes a first circuit pattern and a second circuit pattern. The first circuit pattern includes: a first pad portion configured to be electrically connected to a chip; a second pad portion configured to be electrically connected to a printed circuit board; and a first wiring portion connected to the first pad portion and the second pad portion. The second circuit pattern includes: a third pad portion configured to be electrically connected to a chip; a fourth pad portion configured to be electrically connected to a display panel; and a second wiring portion connected to the third pad portion and the fourth pad portion. The first surface of the base material includes: a first bonding region on which the second pad portion is disposed; and a second bonding region on which the fourth pad portion is disposed. A dummy pattern is disposed on the second surface, corresponding to the second bonding region, of the base material.

Inventors:
JEON SE MI NA (KR)
PARK JI HYO (KR)
CHAE SUNG MIN (KR)
Application Number:
PCT/KR2023/012057
Publication Date:
February 29, 2024
Filing Date:
August 14, 2023
Export Citation:
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Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H05K1/14; H01L23/498; H05K1/11; H05K3/28
Foreign References:
KR20220054102A2022-05-02
KR20160101823A2016-08-26
KR20220055759A2022-05-04
JPH09232708A1997-09-05
KR20080050534A2008-06-05
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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