Title:
FLEXIBLE CIRCUIT BOARD HAVING ENHANCED BENDING DURABILITY AND METHOD FOR PREPARING SAME
Document Type and Number:
WIPO Patent Application WO/2017/052048
Kind Code:
A1
Abstract:
Provided are a flexible circuit board having enhanced bending durability and a method for preparing same. A method for preparing a flexible circuit board having enhanced bending durability, according to the present invention, comprises the steps of: (a) forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on the bottom side of the first dielectric body; (b) preparing a second dielectric body; (c) preparing a first bonding sheet and a first protective sheet which is connected to one end of the first boding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; (d) bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; (e) forming a via hole such that the first ground layer and second ground layer can be conducted; and (f) cutting in the width direction the second dielectric body placed on the first protective sheet.
Inventors:
KIM SANG PIL (KR)
LEE DA YEON (KR)
KOO HWANG SUB (KR)
KIM HYUN JE (KR)
JUNG HEE SEOK (KR)
LEE DA YEON (KR)
KOO HWANG SUB (KR)
KIM HYUN JE (KR)
JUNG HEE SEOK (KR)
Application Number:
PCT/KR2016/007593
Publication Date:
March 30, 2017
Filing Date:
July 13, 2016
Export Citation:
Assignee:
GIGALANE CO LTD (KR)
International Classes:
H05K1/02; H05K3/28; H05K3/46
Foreign References:
| US20140017940A1 | 2014-01-16 | |||
| US20090133906A1 | 2009-05-28 | |||
| US5418504A | 1995-05-23 | |||
| US5982249A | 1999-11-09 | |||
| JP2014082455A | 2014-05-08 |
Attorney, Agent or Firm:
ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM (KR)
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