Title:
FLEXIBLE CIRCUIT BOARD HAVING THREE-LAYER DIELECTRIC BODY AND FOUR-LAYER GROUND LAYER STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/052274
Kind Code:
A1
Abstract:
Disclosed is a flexible circuit board having a three-layer dielectric body and four-layer ground layer structure. A flexible circuit board having a three-layer dielectric body and four-layer ground layer structure, according to the present invention, comprises: a first dielectric body; a second dielectric body facing the flat surface of the first dielectric body; a third dielectric body facing the bottom side of the first dielectric body; a signal line formed on the flat surface of the first dielectric body; a pair of first ground layers laminated on the flat surface of the first dielectric body and having the signal line therebetween; second ground layers laminated on the bottom side of the first dielectric body so as to correspond to the first ground layers; a third ground layer laminated on the flat surface of the second dielectric body; and a fourth ground layer laminated on the bottom side of the third dielectric body.
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Inventors:
KIM SANG PIL (KR)
LEE DA YEON (KR)
KOO HWANG SUB (KR)
KIM HYUN JE (KR)
JUNG HEE SEOK (KR)
LEE DA YEON (KR)
KOO HWANG SUB (KR)
KIM HYUN JE (KR)
JUNG HEE SEOK (KR)
Application Number:
PCT/KR2016/010673
Publication Date:
March 30, 2017
Filing Date:
September 23, 2016
Export Citation:
Assignee:
GIGALANE CO LTD (KR)
International Classes:
H05K1/02; H05K3/42; H05K3/46
Foreign References:
| US20140102763A1 | 2014-04-17 | |||
| US5262594A | 1993-11-16 | |||
| KR20130103347A | 2013-09-23 | |||
| KR100958268B1 | 2010-05-19 | |||
| KR101065279B1 | 2011-09-16 |
Attorney, Agent or Firm:
B&IP-JOOWON PATENT AND LAW FIRM (KR)
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