FLEXIBLE CIRCUIT BOARD AND METHOD FOR PRODUCING SAME AND BEND STRUCTURE OF FLEXIBLE CIRCUIT BOARD

WIPO Patent Application WO/2010/001812

A1

Provided is a flexible circuit board which exhibits durability especially against severe conditions at a repeated bend having a small radius of curvature and exhibits excellent bendability, and also provided is a method for manufacturing same. The flexible circuit board comprises a resin layer and a wiring formed of a metal foil, and is used with a bend provided at at least one position of the wiring, wherein the metal foil consists of a metal having a cubic crystal structure, and, when the bend is cut in the thickness direction from the ridge line, the cross section of the wiring forms a principal orientation on any one plane included in a range from (20 1 0) to (1 20 0) in the rotational direction from (100) to (110) with [001] as the zone axis.  The wiring is formed so that the metal foil consists of a metal having a cubic crystal structure and the ridge line at the bend forms an angle of 2.9-87.1° with respect to one basic crystal axis in the plane of the metal foil.

HATTORI KOICHI (JP)
KIMURA KEIICHI (JP)
KUWASAKI NAOYA (JP)

PCT/JP2009/061644

January 07, 2010

June 25, 2009

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NIPPON STEEL CHEMICAL CO (JP)
HATTORI KOICHI (JP)
KIMURA KEIICHI (JP)
KUWASAKI NAOYA (JP)

H05K1/09; B21B1/40; B21B3/00; C22C9/00; C22F1/08; H05K1/02

JP2008106313A	2008-05-08
JP2008038170A	2008-02-21
JP2005005413A	2005-01-06
JP2003193211A	2003-07-09
JP2002171033A	2002-06-14
JP2002300247A	2002-10-11
JP2001058203A	2001-03-06
JPH039383B2	1991-02-08
JP2007107036A	2007-04-26

See also references of EP 2306794A4
PHYS. REV., vol. 26, 1925, pages 390

SASAKI Kazuya et al. (JP)
Kazuya Sasaki (JP)

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