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Title:
FLEXIBLE CIRCUIT BOARD AND STRUCTURE OF BEND SECTION OF FLEXIBLE CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2011/078259
Kind Code:
A1
Abstract:
Disclosed is a flexible circuit board which has a bend section subjected to repeated bending and straightening with a small radius of curvature under severe conditions and which yet has durability and excellent flexibility. Specifically, the flexible circuit board is provided with a resin layer and wiring formed of metal foil and has a bend section in at least one portion of the wiring, wherein the metal foil is made of a metal having a face-centered cubic structure, wherein the preferred orientation region, in which the fundamental crystal axis <100> of each unit lattice of the face-centered cubic structure is within 10˚ of perpendicular to the thickness direction of the metal foil and to a direction along the surface of the foil, occupies an area of 50% or more of the area of the board, and wherein the breaking elongation of the metal foil in a direction tangent to a cross-section (P) of the wiring taken along a plane extending from the ridge line of the bend section in the thickness direction of the metal foil is 3.5% or more and 20% or less.

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Inventors:
HATTORI Koichi (1, Tsukiji, Kisarazu-sh, Chiba 35, 〒2920835, JP)
服部　公一 (〒35 千葉県木更津市築地１番地　新日鐵化学株式会社内 Chiba, 〒2920835, JP)
Application Number:
JP2010/073198
Publication Date:
June 30, 2011
Filing Date:
December 22, 2010
Export Citation:
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Assignee:
NIPPON STEEL CHEMICAL CO., LTD. (14-1, Sotokanda 4-chome Chiyoda-k, Tokyo 21, 〒1010021, JP)
新日鐵化学株式会社 (〒21 東京都千代田区外神田四丁目１４番１号 Tokyo, 〒1010021, JP)
HATTORI Koichi (1, Tsukiji, Kisarazu-sh, Chiba 35, 〒2920835, JP)
International Classes:
C22F1/08; H05K1/09; B21B3/00; C22F1/00
Attorney, Agent or Firm:
SASAKI Kazuya et al. (5th Floor, TKK Nishishinbashi Bldg. 11-5, Nishi-shinbashi 2-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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