Title:
FLEXIBLE CIRCUIT BOARD, ULTRASONIC FINGERPRINT MODULE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/007981
Kind Code:
A1
Abstract:
The present application discloses a flexible circuit board, an ultrasonic fingerprint module, and an electronic apparatus. The flexible circuit board comprises a substrate, a first pin, and multiple second pins. The substrate comprises a first connection region and a second connection region connected to the first connection region. The first pin is provided at the first connection region, and the multiple second pins are provided at the second connection region. The first pin has a first connection surface located away from the substrate, and is provided with an accommodation space therein. An opening of the accommodation space is located at the first connection surface. When an ultrasonic fingerprint module having the flexible circuit board is applied to an electronic apparatus, electrical connections of the electronic apparatus have improved stability.
Inventors:
LIU XUANXUAN (CN)
Application Number:
PCT/CN2019/112610
Publication Date:
January 21, 2021
Filing Date:
October 22, 2019
Export Citation:
Assignee:
NANCHANG O FILM BIO IDENTIFICATION TECH CO LTD (CN)
International Classes:
G06K9/00
Foreign References:
| CN207690102U | 2018-08-03 | |||
| CN107613675A | 2018-01-19 | |||
| CN207182330U | 2018-04-03 | |||
| CN106405892A | 2017-02-15 | |||
| US20160242295A1 | 2016-08-18 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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