Title:
FLEXIBLE COMPOSITE FILM, AND FLEXIBLE CIRCUIT FILM EMPLOYING SAME
Document Type and Number:
WIPO Patent Application WO/2018/225760
Kind Code:
A1
Abstract:
Provided is a novel flexible composite film and a flexible circuit film which uses the same as a starting material.
The flexible composite film is formed by copper plating a top surface of a functional resin film 1 to which a special function has been added, to form thereon a copper plating film 2. The flexible circuit film has formed thereon a conductive circuit formed by processing the copper plating film 2. The flexible composite film and the flexible circuit film both function not only as conductive members, but also exhibit simultaneously the special function with which the functional resin film 1 is provided.
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Inventors:
MIZOGUCHI MASANORI (JP)
Application Number:
PCT/JP2018/021648
Publication Date:
December 13, 2018
Filing Date:
June 06, 2018
Export Citation:
Assignee:
ASAHI DENKA KENKYUSHO CO LTD (JP)
International Classes:
B32B15/08; B32B3/10; B32B27/00; B32B27/30; H01B5/14; H01B17/56; H05K1/03
Foreign References:
| JP2014209730A | 2014-11-06 | |||
| JP2010268033A | 2010-11-25 | |||
| US20160113760A1 | 2016-04-28 | |||
| JP2015002125A | 2015-01-05 | |||
| JP2002084013A | 2002-03-22 |
Attorney, Agent or Firm:
MUGISHIMA Takashi (JP)
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