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Patent Searching and Data


Title:
FLEXIBLE COPPER CLAD LAMINATE HAVING SUPERIOR INSULATION AND HEAT-RADIATING PROPERTIES, AND PRINTED CIRCUIT BOARD COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2014/168305
Kind Code:
A1
Abstract:
The present invention relates to a thin, flexible, copper clad laminate having superior insulation and heat-radiating properties, and a printed circuit board comprising the same.

Inventors:
JEONG, Young (605-503, Mokdong Apt. 6-danjiMok 5-dong,Yangcheon-gu, Seoul 448-130, 448-130, KR)
OH, Dong Geun (3 Yangjimaeul Kumho Apt, Sunae-dong Bundang-gu,Seongnam-si, Gyeonggi-do 463-920, 463-920, KR)
AHN, Kyung A (4 Shindong-a Apt, Sadang-dongDongjak-gu, Seoul 156-771, 156-771, KR)
Application Number:
KR2013/009235
Publication Date:
October 16, 2014
Filing Date:
October 16, 2013
Export Citation:
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Assignee:
HARBIS CO., LTD (Rm 1010, 1011 Bundangdong brute,16-2 Sunae-dong, Bundang-gu,Seongnam-si, Gyeonggi-do 463-825, 463-825, KR)
International Classes:
B32B15/04; H05K1/05
Foreign References:
KR20100099475A
KR100870971B1
JP2013019056A
KR20120135354A
Attorney, Agent or Firm:
HANBEOT PATENT & LAW FIRM (15th Fl. Salvation Army Bldg, 7 Chungjeong-ro,,Seodaemun-gu, Seoul 120-013, 120-013, KR)
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