Title:
FLEXIBLE MATERIAL USED FOR CAPACITORS, PREPARATION METHOD THEREFOR AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2020/232691
Kind Code:
A1
Abstract:
The present invention relates to the technical field of electronic packaging materials, and specifically relates to a flexible material used for capacitors, a preparation method therefor and a printed circuit board. The flexible material comprises: two electrode layers; and a composite dielectric layer that is provided between the two electrode layers, the composite dielectric layer comprising a dielectric layer which has a high dielectric constant, as well as a highly insulating dielectric layer that is provided at one side or two sides of the dielectric layer having a high dielectric constant. The flexible material used for capacitors in the present invention is provided with a composite dielectric layer that comprises a dielectric layer having a high dielectric constant and a highly insulating dielectric layer, which reduces dielectric loss and leakage current, and increases the capacitance density of the flexible material.
Inventors:
LUO SUIBIN (CN)
YU SHUHUI (CN)
SUN RONG (CN)
YU SHUHUI (CN)
SUN RONG (CN)
Application Number:
PCT/CN2019/088092
Publication Date:
November 26, 2020
Filing Date:
May 23, 2019
Export Citation:
Assignee:
SHENZHEN INST ADV TECH (CN)
International Classes:
B32B15/01; B32B15/20; B32B33/00; B32B37/06; B32B37/10; B32B38/00; C08G73/10; C08K3/24; C08L71/02; C08L79/08; H05K1/16
Foreign References:
| CN107107434A | 2017-08-29 | |||
| CN108300153A | 2018-07-20 | |||
| CN102173155A | 2011-09-07 | |||
| CN101677033A | 2010-03-24 |
Attorney, Agent or Firm:
MING & YUE INTELLECTUAL PROPERTY LAW FIRM (CN)
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