FLEXIBLE METAL-CLAD LAMINATE

WIPO Patent Application WO/2011/152178

A1

Disclosed is a low-cost flexible metal-clad laminate which has excellent mountability, visibility, patternability and peel strength. Specifically disclosed is a laminate which is obtained by arranging a polyamideimide resin film (layer A) on a copper foil directly or with an adhesive layer interposed therebetween and further arranging a polyamideimide resin film (layer B) thereon. The layer A contains a polyamideimide resin (I) that contains an amine component having a naphthalene skeleton and a polyamideimide resin (II) that contains an amine component having an O-tolidine skeleton; the weight ratio (I)/(II) is 95-70/5-30; and the polyamideimide resin (I) and/or the polyamideimide resin (II) has a number average molecular weight of 25,000-100,000. The layer B contains a polyamideimide resin that contains an amine component having an O-tolidine skeleton. The surface of the copper foil facing the layer A has a surface roughness of 3 μm or less, a gloss of 300 or more, and a reflectance of light having a wavelength of 400-800 nm of 20% or more.

TADA, Kenta (1-1 Katata 2-chome, Ohtsu-sh, Shiga 92, 〒5200292, JP)
多田　謙太 (〒92 滋賀県大津市堅田二丁目１番１号　東洋紡績株式会社　内 Shiga, 〒5200292, JP)

JP2011/060860

December 08, 2011

May 11, 2011

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TOYO BOSEKI KABUSHIKI KAISHA (2-8 Dojima Hama 2-chome, Kita-ku Osaka-sh, Osaka 30, 〒5308230, JP)
東洋紡績株式会社 (〒30 大阪府大阪市北区堂島浜二丁目２番８号 Osaka, 〒5308230, JP)
TADA, Kenta (1-1 Katata 2-chome, Ohtsu-sh, Shiga 92, 〒5200292, JP)

B32B15/088; H05K1/03

KAZAHAYA, Nobuaki et al. (Shin-Ei Building 6th Fl, 6-20 Tosabori 1-chome, Nishi-ku, Osaka-sh, Osaka 01, 〒5500001, JP)

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