Title:
FLEXIBLE METAL-CLADDED BASE MATERIAL, METHOD FOR PRODUCING FLEXIBLE METAL-CLADDED BASE MATERIAL, PRINTED WIRING BOARD, MULTILAYER FLEXIBLE PRINTED WIRING BOARD, AND FLEX-RIGID PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2013/077397
Kind Code:
A1
Abstract:
The present invention provides a flexible metal-cladded base material which enables the production of a printed wiring board with improved productivity and with improved dimensional accuracy and can ensure the resultant printed wiring board to have a good easy-to-bend property and heat resistance. The flexible metal-cladded base material (1) according to the present invention comprises a metal foil (2) and a first resin layer (3). The first resin layer (3) is formed from a first resin composition containing a polyamideimide resin. As for the constituent units that constitute the polyamideimide resin, a first constituent unit represented by formula (1) and a second constituent unit represented by formula (2) are included. The content ratio of the second constituent unit is 5 to 35 mol%.
Inventors:
OZEKI TAKAYOSHI
UMEHARA HIROAKI
ESAKI YOSHIAKI
UMEHARA HIROAKI
ESAKI YOSHIAKI
Application Number:
PCT/JP2012/080287
Publication Date:
May 30, 2013
Filing Date:
November 22, 2012
Export Citation:
Assignee:
PANASONIC CORP (JP)
International Classes:
H05K3/46; B32B15/08; B32B15/088; C08G73/14; C08J7/06; H05K1/03
Foreign References:
| JP2001105530A | 2001-04-17 | |||
| JP2008280504A | 2008-11-20 | |||
| JP2011148979A | 2011-08-04 | |||
| JP2011155085A | 2011-08-11 | |||
| JP2010275375A | 2010-12-09 | |||
| JP2010129610A | 2010-06-10 | |||
| JP2001177200A | 2001-06-29 | |||
| JP2011046782A | 2011-03-10 | |||
| JP2004031682A | 2004-01-29 |
Attorney, Agent or Firm:
NISHIKAWA, Yoshikiyo et al. (JP)
Yoshikiyo Nishikawa (JP)
Yoshikiyo Nishikawa (JP)
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Claims: