Title:
FLEXIBLE METAL LAMINATE CONTAINING FLUOROCARBON RESIN
Document Type and Number:
WIPO Patent Application WO/2013/036077
Kind Code:
A3
Abstract:
The present invention relates to a flexible metal laminate having low permittivity, capable of being applied to a soft printed circuit board. According to one aspect of the present invention, the flexible metal laminate comprises: a first metal layer; a first polyimide layer; a polyimide layer in which a fluorocarbon resin, which is formed on the first polyimide layer, is dispersed; and a second polyimide layer formed on the polyimide layer in which a fluorocarbon resin is dispersed, wherein the content per unit volume of the fluorocarbon resin is greater in a depth of 40-60% than in a depth of 5-10% of the total thickness from the surface of the polyimide layer in which a fluorocarbon resin is dispersed.
Inventors:
PARK YOUNG-SEOK (KR)
PARK SOON-YONG (KR)
JANG SE-MYUNG (KR)
PARK SOON-YONG (KR)
JANG SE-MYUNG (KR)
Application Number:
PCT/KR2012/007234
Publication Date:
May 10, 2013
Filing Date:
September 07, 2012
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
PARK YOUNG-SEOK (KR)
PARK SOON-YONG (KR)
JANG SE-MYUNG (KR)
PARK YOUNG-SEOK (KR)
PARK SOON-YONG (KR)
JANG SE-MYUNG (KR)
International Classes:
B32B15/08; B05D7/16; H05K1/03
Foreign References:
JPH0726128U | 1995-05-16 | |||
JP2501331B2 | 1996-05-29 | |||
KR20050106538A | 2005-11-10 | |||
KR100767208B1 | 2007-10-17 | |||
KR100993063B1 | 2010-11-08 |
Attorney, Agent or Firm:
YOU ME PATENT AND LAW FIRM (649-10 Yoksam-dong,Kangnam-ku, Seoul 135-080, KR)
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Claims: