Title:
FLEXIBLE MULTILAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2014/045862
Kind Code:
A1
Abstract:
A flexible multilayer substrate (101) is provided with a laminated body (3) formed of a plurality of resin layers that are laminated and bonded together. The laminated body (3) has slits (31) that penetrate in the depth direction thereof, and viewed in a plane direction, each slit (31) extends from the outer edge of the laminated body (3) to an slit terminus(9) in the interior of the laminated body (3). A reinforcing structure is provided around the circumference of the slit terminus (9).
Inventors:
OTSUBO YOSHIHITO (JP)
Application Number:
PCT/JP2013/073641
Publication Date:
March 27, 2014
Filing Date:
September 03, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02; H05K3/46
Domestic Patent References:
| WO2012147550A1 | 2012-11-01 |
Foreign References:
| JPS6035412A | 1985-02-23 | |||
| JPS60187551U | 1985-12-12 | |||
| JP2006005134A | 2006-01-05 | |||
| JP2008192659A | 2008-08-21 | |||
| JP2001135896A | 2001-05-18 | |||
| JP2005123332A | 2005-05-12 |
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
Patent business corporation Fukami patent firm (JP)
Download PDF: