Title:
FLEXIBLE PACKAGING AGENT FOR SEMICONDUCTOR ELEMENT AND PREPARATION METHOD THEREFOR, AND THIN FILM PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/123746
Kind Code:
A1
Abstract:
Disclosed in the present invention discloses a flexible packaging agent for a semiconductor element and a preparation method therefor, and a thin film packaging method. The flexible packaging agent for the semiconductor element comprises the following components in parts by weight: 10-50 parts of modified cage type oligomeric silsesquioxane, 40-85 parts of a first acrylate diluent, 3-15 parts of a second acrylate diluent, and 0.1-10 parts of a photoinitiator. The flexible packaging agent for the semiconductor element has excellent thermal stability, good flexibility, low water vapor transmittance, and high light transmittance; and in addition, due to a specific structure of the polyfunctional group active modified cage type oligomeric silsesquioxane, the surface tension of a packaging material is effectively improved, such that the packaging material can be well suitable for ink-jet printing, and the packaging effect of the semiconductor element is improved.
Inventors:
LIN YOUQIANG (CN)
SUN FENGZHEN (CN)
LI DELIN (CN)
SUN FENGZHEN (CN)
LI DELIN (CN)
Application Number:
PCT/CN2022/087164
Publication Date:
July 06, 2023
Filing Date:
April 15, 2022
Export Citation:
Assignee:
SHENZHEN SHOUCHENG NEW MATERIAL TECH CO LTD (CN)
International Classes:
C09J183/08; H01L23/29; H01L33/56
Foreign References:
| CN108117624A | 2018-06-05 | |||
| CN113087913A | 2021-07-09 | |||
| CN101024751A | 2007-08-29 | |||
| JP2009256662A | 2009-11-05 | |||
| CN101531839A | 2009-09-16 | |||
| CN110117428A | 2019-08-13 | |||
| JP2006208853A | 2006-08-10 | |||
| JP2020185731A | 2020-11-19 | |||
| CN109651613A | 2019-04-19 | |||
| KR20140132573A | 2014-11-18 | |||
| JP2008084986A | 2008-04-10 |
Attorney, Agent or Firm:
SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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