Title:
FLEXIBLE PELTIER DEVICE AND TEMPERATURE REGULATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/111359
Kind Code:
A1
Abstract:
Provided is a flexible Peltier device in which the heat exchanging properties between a Peltier element and an object to which heat is to be transferred is improved and a flexible heat-dissipating sheet having the Peltier element bonded thereto can be folded without worrying about the detachment of the Peltier element from the heat-dissipating sheet.
The flexible Peltier device (10) is characterized by comprising a flexible heat-dissipating sheet (12) which is made from a heat-conductive rubber containing a heat-conductive filler and which has at least one Peltier element (14) arranged on one surface side thereof, wherein the cooling side and/or the heating side of each of semiconductor elements (14a) (14b) that constitute the Peltier element (14) is bonded integrally to the heat-dissipating sheet (12) directly through the covalent bonding between active groups located on the surface of the cooling side and/or the heating side and active groups located on the surface of the heat-dissipating sheet (12) and/or indirectly through the above-mentioned covalent bonding with a molecule bonding layer interposed therebetween.
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Inventors:
TAKAGI KAZUHISA (JP)
ABE KOICHI (JP)
WATANABE NOBUYOSHI (JP)
TOYOSHIMA SYUHEI (JP)
ABE KOICHI (JP)
WATANABE NOBUYOSHI (JP)
TOYOSHIMA SYUHEI (JP)
Application Number:
PCT/JP2016/050530
Publication Date:
July 14, 2016
Filing Date:
January 08, 2016
Export Citation:
Assignee:
ASAHI FR R&D CO LTD (JP)
International Classes:
H01L35/08; B32B25/20; B32B27/18; H01L35/30; H01L35/32
Domestic Patent References:
| WO2012043631A1 | 2012-04-05 |
Foreign References:
| JP2009302168A | 2009-12-24 | |||
| JP2007153026A | 2007-06-21 |
Other References:
See also references of EP 3244460A4
Attorney, Agent or Firm:
SHINKYU PARTNERS P. C. (JP)
Patent business corporation 眞久 patent firm (JP)
Patent business corporation 眞久 patent firm (JP)
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