Title:
FLEXIBLE PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE COMPRISING SAME, AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2016/099011
Kind Code:
A1
Abstract:
Provided are a flexible printed circuit board, an electronic device comprising the same, and a method for manufacturing a flexible printed circuit board. The flexible printed circuit board comprises: a base film including a bending region, a first region and a second region, wherein the bending region is disposed between the first region and the second region; a first conductive wiring which is formed on one side of the base film; a first protective layer which is formed on the first conductive wiring, and includes the bending region of the base film; a first conductive layer which is formed on the first conductive wiring where the first protective layer is not formed; and a second protective layer which is formed on the first conductive layer and the first protective layer.
Inventors:
LIM JAE JOON (KR)
SON DONG EUN (KR)
JUNG JIN WOOK (KR)
SON DONG EUN (KR)
JUNG JIN WOOK (KR)
Application Number:
PCT/KR2015/010354
Publication Date:
June 23, 2016
Filing Date:
October 01, 2015
Export Citation:
Assignee:
STEMCO CO LTD (KR)
International Classes:
H05K3/28; H05K1/02
Foreign References:
| JP2005049686A | 2005-02-24 | |||
| JP2006108412A | 2006-04-20 | |||
| KR101223701B1 | 2013-01-21 | |||
| KR20140133292A | 2014-11-19 | |||
| KR101402151B1 | 2014-05-30 |
Attorney, Agent or Firm:
KASAN IP & LAW FIRM (KR)
특허법인 가산 (KR)
특허법인 가산 (KR)
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