FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD

WIPO Patent Application WO/2016/113942

A1

The present invention provides a flexible printed circuit board that is not easily subjected to line breakage while still retaining the electrical characteristics thereof and a method for manufacturing such a flexible printed circuit board. Provided is a flexible printed circuit board 10 having at least one set of strip-line transmission paths by providing a signal line 20 and a pair of ground layers 60 and 70 facing the signal line 20 with insulating layers 30 and 40 interposed therebetween, the insulating layers 30 and 40 covering the signal line 20 from both sides and being formed of a thermoplastic resin. The flexible printed circuit board 10 is provided with a pleat portion PL that bends so as to open or close a plurality of bending sections PL2. The ground layers 60 and 70 have hard ground layers 61 and 71 that have a metal surface and that have electromagnetic-wave shielding performance and soft ground layers 62 and 72 that have a higher flexibility and a lower electromagnetic-wave shielding performance than the hard ground layers 61 and 71. The soft ground layers 62 and 72 are disposed on at least one of an outer circumferential side and an inner circumferential side of the bending section PL2.

MATSUDA FUMIHIKO (JP)

PCT/JP2015/073869

July 21, 2016

August 25, 2015

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NIPPON MEKTRON KK (JP)

H05K1/02

WO2012147412A1	2012-11-01
WO2014174882A1	2014-10-30

JP5610110B1	2014-10-22
JP2009176901A	2009-08-06

IAT WORLD PATENT LAW FIRM (JP)
Eye アット international patent business corporation (JP)

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