Title:
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/224866
Kind Code:
A1
Abstract:
This flexible printed circuit board is provided with an insulating layer having a first surface and a second surface that is an opposite surface of the first surface, a first wiring disposed on the first surface, a second wiring disposed on the second surface, and an electroconductive layer. The first wiring has a first land. The second wiring has a second land. The first wiring has a first layer disposed on the first surface, and a second layer disposed on the first layer. The second wiring has a third layer disposed on the second surface, and a fourth layer disposed on the third layer. The first land and the second land overlap in plan view. A through-hole that penetrates the insulating layer in the thickness direction and at least partially overlaps the first land and the second land in plan view is formed in the insulating layer. The electroconductive layer is disposed on the inner wall surface of the through-hole so as to be connected to the first land and the second land.
Inventors:
NAGATA SHINGO (JP)
SAKAI SHOICHIRO (JP)
SATO DAISUKE (JP)
MOTOMURA JUNICHI (JP)
SAKAI SHOICHIRO (JP)
SATO DAISUKE (JP)
MOTOMURA JUNICHI (JP)
Application Number:
PCT/JP2022/017552
Publication Date:
October 27, 2022
Filing Date:
April 12, 2022
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H05K3/18; H05K3/42
Foreign References:
| KR101555014B1 | 2015-09-22 | |||
| CN102686052A | 2012-09-19 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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