Title:
FLEXIBLE PRINTED CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2021/140855
Kind Code:
A1
Abstract:
Provided is a flexible printed circuit board comprising a base film that has a hole for forming a through hole and further comprising a coil shaped circuit layer that is laminated on at least one surface side of the base film, wherein: the circuit layer has a land part that is arranged on an inner circumferential surface of the hole and a circumferential edge part of the hole in the base film, and a winding part that is arranged in a spiral shape having the land part as an inside end part or an outside end part; the winding part has a first winding part that is the outermost circumference and a second winding part that is disposed to the inside of the outermost circumference; and the ratio of the average thickness of the land part to the average thickness of the second winding part is 1.1-5.
Inventors:
SAKAI SHOICHIRO (JP)
NITTA KOJI (JP)
OKA YOSHIO (JP)
MOTOMURA JUNICHI (JP)
YAMASHITA MASANAO (JP)
NITTA KOJI (JP)
OKA YOSHIO (JP)
MOTOMURA JUNICHI (JP)
YAMASHITA MASANAO (JP)
Application Number:
PCT/JP2020/046964
Publication Date:
July 15, 2021
Filing Date:
December 16, 2020
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
C25D5/02; C25D7/00; H01F17/00; H01F27/28; H01F41/04; H05K1/16; H05K3/18
Foreign References:
| JPH11113203A | 1999-04-23 | |||
| JPS5938068Y2 | 1984-10-22 | |||
| JP2016009854A | 2016-01-18 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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