FLEXIBLE PRINTED CIRCUITS FOR USB 3.0 INTERCONNECTS IN MOBILE DEVICES

Title:

FLEXIBLE PRINTED CIRCUITS FOR USB 3.0 INTERCONNECTS IN MOBILE DEVICES

Document Type and Number:

WIPO Patent Application WO/2018/227324

Kind Code:

A1

Abstract:

Systems, apparatus, methods for manufacturing and techniques for interconnecting integrated circuit devices are disclosed. A flexible printed circuit (FPC) provides EMI shielding with reduced insertion loss. The FPC includes a first signal layer fabricated from a planar conductive material and having traces configured to carry signals between a circuit boards. The FPC may include a first non-conductive layer disposed in a plane above the first signal layer, a second non-conductive layer disposed in a plane below the first signal layer, a first copper ground plane disposed in a plane above the first non-conductive layer, a second copper ground plane disposed in a plane below the second non-conductive layer, and a second signal layer provided in a plane above the first copper ground plane or below the second copper ground plane. Signals carried in the first signal layer may have a higher frequency than signals carried in the second signal layer.

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Inventors:

HAN GUOBING (US)
WU JIANXIANG (US)
XIE COOPER (US)
YAN WEI (US)

Application Number:

PCT/CN2017/087877

Publication Date:

December 20, 2018

Filing Date:

June 12, 2017

Export Citation:

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Assignee:

QUALCOMM INC (US)
HAN GUOBING (CN)
WU JIANXIANG (CN)
XIE COOPER (CN)
YAN WEI (CN)

International Classes:

H05K9/00

Foreign References:

US20090188712A1	2009-07-30
US20090133906A1	2009-05-28
CN203896584U	2014-10-22
CN102307428A	2012-01-04
CN205385649U	2016-07-13
CN1734843A	2006-02-15

Other References: