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Patent Searching and Data


Title:
FLEXIBLE PRINTED WIRING BOARD FOR CHIP-ON-FILM
Document Type and Number:
WIPO Patent Application WO/2003/096776
Kind Code:
A1
Abstract:
A flexible printed wiring board that has an insulating layer of high light transmission, is excellent in adhesive strength and migration resistance and is suitable for chip-on-film (referred to as COF). In particular, a flexible printed wiring board for COF having an insulating layer laminated with a conductive layer of electrolytic copper foil, the insulating layer after etching of the conductive layer so as to form a circuit exhibiting a light transmission of 50% or higher at etching area, wherein the electrolytic copper foil at its surface bonded to the insulating layer is provided with a rustproof layer of nickel/zinc alloy, the bonded surface exhibiting a surface roughness (Rz) of 0.05 to 1.5 μm and a specular glossiness of 250 or greater at an incident angle of 60º.

Inventors:
OKADA KAZUYUKI (JP)
HARA YASUJI (JP)
UCHIYAMA AKIRA (JP)
TAKAHASHI MASARU (JP)
Application Number:
PCT/JP2003/005891
Publication Date:
November 20, 2003
Filing Date:
May 12, 2003
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO (JP)
OKADA KAZUYUKI (JP)
HARA YASUJI (JP)
UCHIYAMA AKIRA (JP)
TAKAHASHI MASARU (JP)
International Classes:
C23C26/00; C23C28/00; C23C30/00; C25D1/04; C25D3/56; C25D5/48; H05K3/38; H05K1/00; (IPC1-7): H05K1/09; H05K3/38; C23C28/00; C23C30/00
Foreign References:
JP2003023046A2003-01-24
JPH07231161A1995-08-29
US5833819A1998-11-10
JP2000269637A2000-09-29
Attorney, Agent or Firm:
Tanaka, Daisuke (15-2 Hongo 1-chom, Bunkyo-ku Tokyo, JP)
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