FLEXIBLE PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

Title:

FLEXIBLE PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

Document Type and Number:

WIPO Patent Application WO/2021/200614

Kind Code:

A1

Abstract:

A flexible printed wiring board of an embodiment of the present disclosure is provided with a base film and a wiring layer having multiple wires and disposed on at least one surface of the base film, wherein the wires have an average line width of 30 µm or less and an average spacing of 30 µm or less, and the wires have a copper-based plating layer, said copper-based plating layer having an electrical resistivity of higher than 1.68 x 10-8 Ω·m.

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Inventors:

TAKAHASHI KENJI (JP)
SAKAI SHOICHIRO (JP)

Application Number:

PCT/JP2021/012774

Publication Date:

October 07, 2021

Filing Date:

March 26, 2021

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Assignee:

SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)

International Classes:

C25D3/38; C25D7/00; H05K1/09; H05K3/18

Domestic Patent References:

WO2007039992A1	2007-04-12
WO2016104530A1	2016-06-30

Foreign References:

JP2014082320A	2014-05-08
JP2006057177A	2006-03-02
JP2012522898A	2012-09-27

Attorney, Agent or Firm:

MORITA Takeshi et al. (JP)

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