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Title:
FLEXIBLE PRINTED WIRING BOARD AND PRODUCTION METHOD FOR FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2016/208612
Kind Code:
A1
Abstract:
This flexible printed wiring board comprises: a base film having insulating properties; and a conductive pattern laminated on one surface side of this base film. The conductive pattern constitutes part of a circuit. The flexible printed wiring board has at least one fuse having a smaller cross-sectional area than the other part of the circuit. The conductive pattern has a pair of measurement pads provided so as to be capable of measuring the potential difference between two points in the vicinity of both ends of the fuse.

Inventors:
TSUMAGARI TAKAYUKI (JP)
UCHITA TOSHIFUMI (JP)
TAKASE SHINICHI (JP)
SAITO HIROHISA (JP)
Application Number:
PCT/JP2016/068487
Publication Date:
December 29, 2016
Filing Date:
June 22, 2016
Export Citation:
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Assignee:
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
International Classes:
H01H85/046; H01H69/02; H05K1/02; H05K1/16; H05K3/00
Foreign References:
JPS53109058U1978-09-01
JP2001520436A2001-10-30
JP2006237299A2006-09-07
JPS55108776U1980-07-30
JP2003298195A2003-10-17
JP2007317990A2007-12-06
Attorney, Agent or Firm:
AMANO KAZUNORI (JP)
Kazuki Amano (JP)
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