Title:
FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2018/163878
Kind Code:
A1
Abstract:
A flexible printed wiring board which is provided with: a substrate layer that has insulating properties; a conductive pattern that is laminated on at least one surface of the substrate layer; and a cover layer that covers a surface of a laminate which comprises the substrate layer and the conductive pattern, on said surface the conductive pattern being present. A high magnetic permeability member is present in a region of the substrate layer or a region of the cover layer, said region overlapping a coil region of the conductive pattern comprising at least a coil when viewed in plan.
Inventors:
TAKEMOTO TSUYOSHI (JP)
UEDA HIROSHI (JP)
UEDA HIROSHI (JP)
Application Number:
PCT/JP2018/006906
Publication Date:
September 13, 2018
Filing Date:
February 26, 2018
Export Citation:
Assignee:
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H05K1/16; H01F17/00; H05K1/03; H05K3/28
Foreign References:
| JP2007503716A | 2007-02-22 | |||
| JP2006303405A | 2006-11-02 | |||
| JPS61169905U | 1986-10-21 | |||
| JP2013201415A | 2013-10-03 | |||
| JPS5828819A | 1983-02-19 | |||
| JP2003261745A | 2003-09-19 |
Attorney, Agent or Firm:
NISHIMA Hideaki et al. (JP)
Download PDF:
Previous Patent: TURBINE BLADE, TURBINE, AND METHOD FOR COOLING TURBINE BLADE
Next Patent: DECORATIVE SHEET AND METHOD FOR MANUFACTURING SAME
Next Patent: DECORATIVE SHEET AND METHOD FOR MANUFACTURING SAME