Title:
FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/009269
Kind Code:
A1
Abstract:
A flexible printed wiring board according to one embodiment of the present invention is provided with: an insulating base film; a conductive pattern which is laminated on at least the back surface of the base film and comprises a spiral coil pattern; and a plating layer which is laminated on the back surface of the conductive pattern and is formed of a ferromagnetic body. The plating layer may be directly laminated on at least a part of the conductive pattern. The conductive pattern may additionally comprise a coil core pattern that is formed inside the innermost turn of the coil pattern.
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Inventors:
MIURA KOUSUKE (JP)
KOCHI MASAHIKO (JP)
KOCHI MASAHIKO (JP)
Application Number:
PCT/JP2018/025127
Publication Date:
January 10, 2019
Filing Date:
July 03, 2018
Export Citation:
Assignee:
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H02J50/10; H01F17/00; H01F27/28; H01F38/14; H05K1/02; H05K1/16
Foreign References:
| JPS5750410A | 1982-03-24 | |||
| JP2013140880A | 2013-07-18 | |||
| JPH1050522A | 1998-02-20 | |||
| JPH05160344A | 1993-06-25 | |||
| JP2017216407A | 2017-12-07 |
Attorney, Agent or Firm:
NISHIMA Hideaki et al. (JP)
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