Title:
FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/194059
Kind Code:
A1
Abstract:
A flexible printed wiring board of one embodiment includes: a substrate layer that has insulating properties; and a conductive pattern that is layered onto at least one surface of the substrate layer. The conductive pattern includes a spiral-shaped coil region, and the cross-sectional area of the conductive pattern in the coil region becomes larger, gradually or in a stepwise manner, towards the center of the spiral shape.
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Inventors:
UEDA HIROSHI (JP)
Application Number:
PCT/JP2019/013513
Publication Date:
October 10, 2019
Filing Date:
March 28, 2019
Export Citation:
Assignee:
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H01F17/00; H05K1/16
Domestic Patent References:
| WO2017026320A1 | 2017-02-16 |
Foreign References:
| JP2013115131A | 2013-06-10 | |||
| JPH1140438A | 1999-02-12 |
Attorney, Agent or Firm:
MORITA Takeshi et al. (JP)
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