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Patent Searching and Data


Title:
FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/194059
Kind Code:
A1
Abstract:
A flexible printed wiring board of one embodiment includes: a substrate layer that has insulating properties; and a conductive pattern that is layered onto at least one surface of the substrate layer. The conductive pattern includes a spiral-shaped coil region, and the cross-sectional area of the conductive pattern in the coil region becomes larger, gradually or in a stepwise manner, towards the center of the spiral shape.

Inventors:
UEDA Hiroshi (INC. 30, Hinokigaoka, Minakuchi-cho, Koka-sh, Shiga 68, 〒5280068, JP)
Application Number:
JP2019/013513
Publication Date:
October 10, 2019
Filing Date:
March 28, 2019
Export Citation:
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Assignee:
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. (30 Hinokigaoka, Minakuchi-cho Koka-sh, Shiga 68, 〒5280068, JP)
International Classes:
H01F17/00; H05K1/16
Domestic Patent References:
WO2017026320A12017-02-16
Foreign References:
JP2013115131A2013-06-10
JPH1140438A1999-02-12
Attorney, Agent or Firm:
MORITA Takeshi et al. (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
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