Title:
FLEXIBLE SENSOR SEMICONDUCTOR PACKAGE FOR FINGERPRINT RECOGNITION IN SMART DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/142198
Kind Code:
A1
Abstract:
A flexible sensor semiconductor package for fingerprint recognition, of the present invention, comprises: a flexible strip PCB; one or more flexible sensor dies stacked on the flexible strip PCB; a conductive wire for electrically connecting the flexible strip PCB with the flexible sensor die; and a flexible encapsulation for protecting at least the flexible sensor die and the conductive wire, and thus the flexible sensor semiconductor package can be used for a module which is not flexible but curved in a predetermined radius or for a module which has flexibility so as to be freely flexible.
Inventors:
LIM JAE SUNG (KR)
KIM JIN CHUN (KR)
KIM JIN CHUN (KR)
Application Number:
PCT/KR2017/000295
Publication Date:
August 24, 2017
Filing Date:
January 10, 2017
Export Citation:
Assignee:
HANA MICRON INC (KR)
International Classes:
G06K9/00; H01L23/15; H01L23/31; H01L23/495; H01L23/498
Foreign References:
| KR20150081604A | 2015-07-15 | |||
| KR20140029081A | 2014-03-10 | |||
| JP2013513962A | 2013-04-22 | |||
| JP2007143909A | 2007-06-14 | |||
| KR20150019628A | 2015-02-25 |
Attorney, Agent or Firm:
ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM (KR)
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