Title:
FLEXIBLE SOLDER ICICLE REMOVING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/140841
Kind Code:
A1
Abstract:
A flexible solder icicle pressing device comprises a frame (5). A solder icicle pressing assembly (1) and an ejection plate assembly (6) are installed at the frame. The solder icicle pressing assembly comprises an installation plate (12) and a solder icicle pressing unit (13). The solder icicle pressing unit comprises a press block (133) and an elastic element (131). Both ends of the elastic element respectively abut against the installation plate and the press block. The ejection plate assembly comprises an ejection plate (61) and a first driving unit (64). The first driving unit can drive the ejection plate to move toward the press block. In the solder icicle pressing device, an elastic press block of a solder icicle pressing assembly cooperates with an ejection plate assembly to remove a solder icicle, thereby effectively removing solder icicles without damaging an object being pressed. The invention is applicable to an automated process, and has high efficiency of removing solder icicles.
Inventors:
ZHAO SHENGYU (CN)
LIU MINGQING (CN)
WANG JIESHUN (CN)
ZHONG HUI (CN)
HUANG SHISHENG (CN)
GAO CAIFENG (CN)
ZHANG PAN (CN)
ZHOU YUCHAO (CN)
ZHANG SONGLING (CN)
LIU MINGQING (CN)
WANG JIESHUN (CN)
ZHONG HUI (CN)
HUANG SHISHENG (CN)
GAO CAIFENG (CN)
ZHANG PAN (CN)
ZHOU YUCHAO (CN)
ZHANG SONGLING (CN)
Application Number:
PCT/CN2018/089595
Publication Date:
July 25, 2019
Filing Date:
June 01, 2018
Export Citation:
Assignee:
SHENZHEN HYMSON LASER INTELLIGENT EQUIPMENTS CO LTD (CN)
International Classes:
B23K3/08; H05K3/34
Foreign References:
| JP2002198641A | 2002-07-12 | |||
| CN205847743U | 2016-12-28 | |||
| CN104105358A | 2014-10-15 | |||
| CN203437787U | 2014-02-19 | |||
| JPS6219261B2 | 1987-04-27 | |||
| JPH06140119A | 1994-05-20 | |||
| US5228614A | 1993-07-20 |
Attorney, Agent or Firm:
JIAQUAN IP LAW FIRM (CN)
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