FLEXIBLE SUBSTRATE MODULE

WIPO Patent Application WO/2011/158697

A1

Disclosed is a flexible substrate module that uses a flexible substrate and has sufficiently excellent heat dissipation properties against a mounted heat source, and sufficiently excellent flexibility and accumulation. The flexible substrate module (1) is configured such that a printed wiring layer (12) is formed as a surface layer laminated to the surface side of a flexible insulated base material (11), and a heat source (14) is mounted on the printed wiring layer (12); and is characterized by having, as rear surface layers that are laminated on to the rear surface side of the flexible insulated base material (11), a plurality of laminated thermal expansion promotion layers (21, 23) in the flexible substrate module (1) facing and attached to a casing (K) to which the module is to be attached, made from a highly heat conductive material and for promoting expansion, towards the casing (K) to which the module is to be attached, of the surface area of hot spots that are heat-transferred from the heat source (14) to the printed wiring layer (12).

AKAHANE, Yoshihiro (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
赤羽　良啓 (〒24 大阪府大阪市此花区島屋一丁目１番３号　住友電気工業株式会社大阪製作所内 Osaka, 〒5540024, JP)
MATSUBARA, Hideki (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
松原　秀樹 (〒24 大阪府大阪市此花区島屋一丁目１番３号　住友電気工業株式会社大阪製作所内 Osaka, 〒5540024, JP)
SAITO, Hirohisa (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
齊藤　裕久 (〒24 大阪府大阪市此花区島屋一丁目１番３号　住友電気工業株式会社大阪製作所内 Osaka, 〒5540024, JP)

JP2011/063035

December 22, 2011

June 07, 2011

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SUMITOMO ELECTRIC INDUSTRIES, LTD. (5-33, Kitahama 4-chome Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
住友電気工業株式会社 (〒41 大阪府大阪市中央区北浜四丁目５番３３号 Osaka, 〒5410041, JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. (30 Hinokigaoka, Minakuchi-cho Koka-sh, Shiga 68, 〒5280068, JP)
住友電工プリントサーキット株式会社 (〒68 滋賀県甲賀市水口町ひのきが丘３０番地 Shiga, 〒5280068, JP)
AKAHANE, Yoshihiro (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
赤羽　良啓 (〒24 大阪府大阪市此花区島屋一丁目１番３号　住友電気工業株式会社大阪製作所内 Osaka, 〒5540024, JP)
MATSUBARA, Hideki (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
松原　秀樹 (〒24 大阪府大阪市此花区島屋一丁目１番３号　住友電気工業株式会社大阪製作所内 Osaka, 〒5540024, JP)

H05K1/02; F21V29/00; F21Y101/02

NAKATA, Motomi et al. (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)

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