Title:
FLEXIBLE SUBSTRATE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/008083
Kind Code:
A1
Abstract:
Provided are a flexible substrate (10) and a preparation method therefor. The flexible substrate (10) comprises a first flexible layer (11), a barrier layer (12), a second flexible layer (13), and a buffer layer (14). The barrier layer (12) is provided on the surface of the first flexible layer (11). A first bending-resistant structure (121) is coated in the barrier layer (12). The second flexible layer (13) is provided on the surface of the barrier layer (12). The buffer layer (14) is provided on the surface of the second flexible layer (13). A second bending-resistant structure (141) is coated in the buffer layer (14).
Inventors:
DING FENG (CN)
Application Number:
PCT/CN2019/128082
Publication Date:
January 21, 2021
Filing Date:
December 24, 2019
Export Citation:
Assignee:
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD (CN)
International Classes:
G09F9/30
Foreign References:
| CN110444116A | 2019-11-12 | |||
| CN108281388A | 2018-07-13 | |||
| CN105870355A | 2016-08-17 | |||
| CN109638178A | 2019-04-16 | |||
| US9070889B2 | 2015-06-30 | |||
| US9257674B2 | 2016-02-09 |
Attorney, Agent or Firm:
PURPLEVINE INTELLECTUAL PROPERTY (SHENZHEN) CO., LTD (CN)
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