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Title:
FLEXIBLE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/110421
Kind Code:
A1
Abstract:
A flexible substrate according to one embodiment of the present invention is provided with: a flexible insulating base material which has a first surface and a second surface that is on the reverse side of the first surface; a plurality of wiring lines that are provided on the second surface of the insulating base material; a first low rigidity layer which has a first inner surface that faces the first surface and a first outer surface that is on the reverse side of the first inner surface; a second low rigidity layer which has a second inner surface that faces the second surface, with the wiring lines being interposed therebetween, and a second outer surface that is on the reverse side of the second inner surface; a first high rigidity layer which is in contact with the first outer surface, while having a higher elastic modulus than the first low rigidity layer; and a second high rigidity layer which is in contact with the second outer surface, while having a higher elastic modulus than the second low rigidity layer. With respect to this flexible substrate, the elastic modulus of the first low rigidity layer and the elastic modulus of the second low rigidity layer are lower than the elastic modulus of the insulating base material.

Inventors:
SANO TAKUMI (JP)
Application Number:
PCT/JP2019/035580
Publication Date:
June 04, 2020
Filing Date:
September 10, 2019
Export Citation:
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Assignee:
JAPAN DISPLAY INC (JP)
International Classes:
H05K1/02; G09F9/30; H05K1/03; H05K3/28
Foreign References:
JP2013151638A2013-08-08
US20170062741A12017-03-02
JP2009048007A2009-03-05
US20100330338A12010-12-30
US20170057704A12017-03-02
Attorney, Agent or Firm:
S & S INTERNATIONAL PPC (JP)
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