FLEXIBLE WIRING BASE, WIRING SUBSTRATE, SOLAR CELL MODULE AND IC CARD

Title:

FLEXIBLE WIRING BASE, WIRING SUBSTRATE, SOLAR CELL MODULE AND IC CARD

Document Type and Number:

WIPO Patent Application WO/2015/025834

Kind Code:

A1

Abstract:

This flexible wiring base comprises: a base material; an adhesive layer that is formed of one or more layers and is laminated on the base material; and a metal foil that is bonded to the base material with the adhesive layer being interposed therebetween. The Vickers hardness of each layer constituting the adhesive layer is lower than the Vickers hardness of the base material, and at least one layer among the layer(s) constituting the adhesive layer has a Vickers hardness of 1 or more.

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Inventors:

KUDO SHIGEKI (JP)
NAKATANI MAYUMI (JP)
TAKAHASHI WATARU (JP)

Application Number:

PCT/JP2014/071617

Publication Date:

February 26, 2015

Filing Date:

August 19, 2014

Export Citation:

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Assignee:

TOPPAN PRINTING CO LTD (JP)

International Classes:

H05K1/03; B26F1/00; G06K19/077; H01L31/049; H01L31/05; H05K3/04

Domestic Patent References:

WO2009110376A1

2009-09-11

Foreign References:

JPH1197822A	1999-04-09
JP2000515683A	2000-11-21
JPH09293950A	1997-11-11
JP2005503033A	2005-01-27
JP2008235537A	2008-10-02

Attorney, Agent or Firm:

SUZUKI Shirou et al. (JP)
Shiro Suzuki (JP)

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