Title:
FLEXIBLE WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2012/137527
Kind Code:
A1
Abstract:
A flexible wiring board which can be manufactured inexpensively and has excellent heat resistance and flexibility is provided. The flexible wiring board (10) contains a clay film (12) in which clay particles are oriented and laminated. A metal foil (14) is directly bonded to the surface of the clay substrate (12). The surface roughness (Rz) of the metal foil at the surface where the metal foil and the clay film are bonded is set in such a manner as to be 2.0 to 7.0. The clay film may contain a resin, and in this case, the percentage of the resin at the bonding interface between the metal foil and the clay film is set in such a manner as to be higher than the percentage of resin inside the clay film. Etching is carried out on the metal foil (14) so as to form wiring patterns on the clay substrate (12).
Inventors:
KAWATA SHUICHI (JP)
TAKADA TAKAHIRO (JP)
TAKADA TAKAHIRO (JP)
Application Number:
PCT/JP2012/051932
Publication Date:
October 11, 2012
Filing Date:
January 30, 2012
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
KAWATA SHUICHI (JP)
TAKADA TAKAHIRO (JP)
KAWATA SHUICHI (JP)
TAKADA TAKAHIRO (JP)
International Classes:
H05K1/03; C01B33/40; H05K1/09
Domestic Patent References:
| WO2009008029A1 | 2009-01-15 | |||
| WO2007088815A1 | 2007-08-09 | |||
| WO2006062138A1 | 2006-06-15 |
Foreign References:
| JP2004230670A | 2004-08-19 | |||
| JP2008226800A | 2008-09-25 | |||
| JP2007335448A | 2007-12-27 | |||
| JP2007022075A | 2007-02-01 | |||
| JP2008137828A | 2008-06-19 | |||
| JP2008137161A | 2008-06-19 |
Attorney, Agent or Firm:
OKADA, MASAHIRO (JP)
Zenkei Okada (JP)
Zenkei Okada (JP)
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Claims:
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