Title:
FLIP CHIP BONDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/076895
Kind Code:
A1
Abstract:
This flip chip bonding device is provided with a dispenser unit that supplies and applies a bonding auxiliary agent on each electrode on a substrate. When metal bonding between a first electrode and a second electrode is carried out by ultrasonic bonding between metals that include at least copper, a copper oxide film that has already formed on the bonding interface of the first electrode and second electrode can be eliminated and the formation of oxide films in the bonding interface with the implementation of ultrasonic bonding can be inhibited by carrying out ultrasonic bonding in a state where a bonding auxiliary agent that has reductive properties is present at least around the bonding interface of the first electrode and second electrode. Bonding between metals that contain at least copper can be achieved while assuring the required bonding strength, and costs can be reduced in mounting semiconductor elements and manufacturing substrates on which those semiconductor elements are installed.
Inventors:
KOJIO TEPPEI
SAKAI TADAHIKO
ISHIKAWA TAKATOSHI
MUKOHJIMA HITOSHI
TAKAKURA KENICHI
ISHIMATSU KEN
SONODA TOMOYUKI
SAKAI TADAHIKO
ISHIKAWA TAKATOSHI
MUKOHJIMA HITOSHI
TAKAKURA KENICHI
ISHIMATSU KEN
SONODA TOMOYUKI
Application Number:
PCT/JP2012/006030
Publication Date:
May 30, 2013
Filing Date:
September 21, 2012
Export Citation:
Assignee:
PANASONIC CORP (JP)
International Classes:
H01L21/60; H01L21/607
Foreign References:
| JP2003007764A | 2003-01-10 | |||
| JPH08293665A | 1996-11-05 | |||
| JP2001244618A | 2001-09-07 | |||
| JPH06326449A | 1994-11-25 | |||
| JPH09148377A | 1997-06-06 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
Mutsumi Sameshima (JP)
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Claims:
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