Title:
FLIP CHIP LASER BONDING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2020/226222
Kind Code:
A1
Abstract:
The present invention relates to a flip chip laser bonding system and, more specifically, to a flip chip laser bonding system for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam. The flip chip laser bonding system according to the present invention laser-bonds the semiconductor chip to a substrate while pressing same, thereby enabling even the semiconductor chip that is bent or is likely to bend to be bonded to the substrate without the contact failure of solder bumps.
Inventors:
KO YOUN SUNG (KR)
AHN GEUN SIK (KR)
AHN GEUN SIK (KR)
Application Number:
PCT/KR2019/006792
Publication Date:
November 12, 2020
Filing Date:
June 05, 2019
Export Citation:
Assignee:
PROTEC CO LTD (KR)
International Classes:
H01L21/56; B23K26/20; H01L21/67; H01L23/00
Foreign References:
| KR20180137888A | 2018-12-28 | |||
| JP2000040712A | 2000-02-08 | |||
| JP2000225480A | 2000-08-15 | |||
| JPH05335377A | 1993-12-17 | |||
| KR20140141430A | 2014-12-10 |
Attorney, Agent or Firm:
YANG, Dooyol (KR)
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