Title:
FLIP CHIP AND CHIP PACKAGING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/001465
Kind Code:
A1
Abstract:
A flip chip and a chip packaging structure, relating to the technical field of display. The flip chip comprises a driving chip (100) and a plurality of conductive connecting members (200). The driving chip (100) has a packaging surface (160) facing a wiring substrate; any one of the conductive connecting members (200) comprises conductive convex points (210) connected to the packaging surface (160) and a conductive epitaxial portion (220) located on the sides, far away from the driving chip (100), of the conductive convex points (210). The flip chip can improve the stability of the chip packaging structure.
Inventors:
YU YONG (CN)
GONG XUERUI (CN)
ZHANG CHANG (CN)
GONG XUERUI (CN)
ZHANG CHANG (CN)
Application Number:
PCT/CN2021/094916
Publication Date:
January 06, 2022
Filing Date:
May 20, 2021
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
CHENGDU BOE OPTOELECT TECH CO (CN)
CHENGDU BOE OPTOELECT TECH CO (CN)
International Classes:
H01L23/48; H01L23/488
Foreign References:
| CN212136426U | 2020-12-11 | |||
| CN1956177A | 2007-05-02 | |||
| KR20040017692A | 2004-02-27 | |||
| CN105934816A | 2016-09-07 | |||
| CN104035253A | 2014-09-10 | |||
| JPH08136944A | 1996-05-31 |
Attorney, Agent or Firm:
BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD. (CN)
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