Title:
FLIP CHIP STRUCTURE AND METHOD FOR PREPARATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/142865
Kind Code:
A1
Abstract:
Provided by the present invention are a flip chip structure and a method for preparation thereof; the flip chip structure comprises a substrate, a metal pad disposed on the substrate, a metal seed layer, and bumps; the bumps gradually become larger along the direction away from the metal seed layer. In the present invention, by means of the arrangement of the inclined inner side face of a photoresist layer and the inclined side wall face of the bumps, the two can be better combined, and the plating bath is prevented from seeping down along the side wall surface of the bumps, resulting in the abnormality of plating seepage.
Inventors:
CHEN HAO (CN)
Application Number:
PCT/CN2021/132273
Publication Date:
July 07, 2022
Filing Date:
November 23, 2021
Export Citation:
Assignee:
CHIPMORE TECH CORPORATION LIMITED (CN)
HEFEI CHIPMORE TECH CO LTD (CN)
HEFEI CHIPMORE TECH CO LTD (CN)
International Classes:
H01L23/498; H01L21/60; H01L23/488
Foreign References:
| CN112687647A | 2021-04-20 | |||
| CN101388374A | 2009-03-18 | |||
| CN112017978A | 2020-12-01 | |||
| CN105355574A | 2016-02-24 | |||
| US20020149118A1 | 2002-10-17 |
Attorney, Agent or Firm:
SUZHOU WISPRO INTELLECTUAL PROPERTY AGENCY (CN)
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