FLIP-CHIP SYSTEM AND METHOD OF MAKING SAME

Title:

FLIP-CHIP SYSTEM AND METHOD OF MAKING SAME

Document Type and Number:

WIPO Patent Application WO2004039886

Kind Code:

A3

Abstract:

A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that alone exhibits a CTE that is characteristic of an inorganic-filled underfill composite previously known. An embodiment is also directed to the assembly of a flip-chip package that uses an underfill mixture.

Inventors:

SHI SONG-HUA
CHEN TIAN-AN

Application Number:

PCT/US2003/033737

Publication Date:

July 22, 2004

Filing Date:

October 23, 2003

Export Citation:

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Assignee:

INTEL CORP (US)

International Classes:

C08L63/00; H01L21/56; C08L65/00; (IPC1-7): C08L65/00; C08L63/00; H01L21/56

Domestic Patent References:

WO2003036692A2	2003-05-01
WO2000031183A1	2000-06-02
WO1999021226A1	1999-04-29

Foreign References:

US6180696B1

2001-01-30

Other References:

VO H T ET AL: "Towards model-based engineering of underfill materials: CTE modeling", MICROELECTRONICS JOURNAL, MACKINTOSH PUBLICATIONS LTD. LUTON, GB, vol. 32, no. 4, 1 April 2001 (2001-04-01), pages 331 - 338, XP004231895, ISSN: 0026-2692
CHAN Y C ET AL: "The effect of metal oxide on the no-flow underfill fluxing capacity", MATERIALS SCIENCE AND ENGINEERING B, ELSEVIER SEQUOIA, LAUSANNE, CH, vol. 85, no. 1, 6 August 2001 (2001-08-06), pages 64 - 69, XP004246513, ISSN: 0921-5107

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